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Quad-flat no-leads (QFN)

2018-2-14 View:
"Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the surfaces of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB. Flat no-lead packages include an exposed thermal pad to improve heat transfer out of the IC (into the PCB). Heat transfer can be further facilitated by metal vias in the thermal pad.  The QFN package is similar to the quad-flat package, and a ball grid array.

QFN Technology in RFID Solutions:
Normally our RFID tag is directly bound to the antenna by wafer. As in our UHF Metal tags, we can use QFN technology to bind to the antenna, which is mainly used to resist high temperature in the special occasions where high performance is required to the tags.

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OPPIOT Technologies Co., Ltd. is a leading trusted Industrial RFID tags manufacturer and supplier in China. Since our establishment in 2013, we have been endeavoring to provide best in class, cost effective and practical RFID solutions to a wide range of industries worldwide.
We have our own production line for RFID tags with bringing in full set of advanced equipments for R&D
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